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Spectroscopic diagnostics of CF/sub 4/-O/sub 2/ plasmas during Si and SiO/sub 2/ etching processes

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.329748· OSTI ID:6563638

The emission intensities in the range of 2000--8000 A of CF, CF/sub 2/, O, F, CO, CO/sup +/, and CO/sub 2/ produced in CF/sub 4//O/sub 2/ radio-frequency discharges, operated at 1 Torr of pressure and 50 W of power input, have been used to follow the etching process of Si and SiO/sub 2/, as a function of the CF/sub 4//O/sub 2/ feed composition. The addition of small amounts of nitrogen or argon to the plasma mixtures has permitted the determination of the effect of the oxygen addition to the gas feed on the electron densities of the plasma for a wide range of electron energies. The relative concentration profiles of F and O, as well as of CO and CO/sub 2/, have been determined with this technique, as a function of the oxygen content in the feed. The important role played by atomic F as active etchant for both Si and SiO/sub 2/ substrates has been confirmed.

Research Organization:
Centro di Studio per la Chimica dei Plasmi del C. N. R., Istituto di Chimica Generale ed Inorganica dell'Universita, Bari, Italy
OSTI ID:
6563638
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 52:3; ISSN JAPIA
Country of Publication:
United States
Language:
English