Effect of alumina composition on interfacial chemistry and strength of direct bonded copper-alumina

Conference · Sun Oct 01 04:00:00 EDT 1989 · Ceramic Engineering and Science Proceedings; (USA)

OSTI ID:6926423

Holowczak, J E; Greenhut, V A; Shanefield, D J

The gas-metal eutectic method was used to bond copper to sintered high alumina ceramics which had different sintering aid compositions in the magnesia-calcia-silica system. The highest average copper-alumina peel adhesion strength, 205 N/cm, was observed for alumina which contained 0.2 percent magnesia and 0.2 percent calcia. The lowest peel adhesion strength, 103 N/cm, was observed for copper bonded to 95 percent alumina which contained magnesia, calcia, and silica additions. This bond strength was similar to that for commercial 96 percent alumina. Statistical matrix experiments showed that alumina containing calcium silicate had significantly lower copper bond strength. This may be attributed to the formation of a transition compound other than the copper aluminate phase identified for well bonded samples in this study. 10 refs.

• OSTI ID: 6926423
• Report Number(s): CONF-890130--
• Conference Information: Journal Name: Ceramic Engineering and Science Proceedings; (USA) Journal Volume: 10
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
ALKALINE EARTH METAL COMPOUNDS
ALLOYS
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
BONDING
CALCIUM COMPOUNDS
CALCIUM OXIDES
CERAMICS
CHALCOGENIDES
COMPOSITE MATERIALS
COPPER ALLOYS
FABRICATION
FIBERS
INTERFACES
JOINING
MAGNESIUM COMPOUNDS
MAGNESIUM OXIDES
MATERIALS
OXIDES
OXYGEN COMPOUNDS
SINTERING
STABILITY