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Depth uniformity of electrical properties and doping limitation in neutron-transmutation-doped semi-insulating GaAs

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.345303· OSTI ID:6925094
;  [1];  [2]
  1. College of Engineering Research Center of Ion Beam Technology, Hosei University, Koganei, Tokyo 184, Japan (JP)
  2. Research Reactor Institute, Kyoto University, Kumatori, Osaka 590-04, Japan (JP)

Depth uniformity of electrical properties has been evaluated for neutron-transmutation-doped (NTD), semi-insulating GaAs irradiated with thermal neutrons of 1.5{times}10{sup 18} cm{sup {minus}2} by the van der Pauw method combined with iterative etching of the surface. In NTD-GaAs wafers (thickness {similar to}410 {mu}m) annealed for 30 min at 700 {degree}C, the depth profiles of the resistivity, the carrier concentration, and the Hall mobility show constant values of 1{times}10{sup {minus}2} {Omega} cm, 2.0{times}10{sup 17} cm{sup {minus}3}, and 3100 cm{sup 2}/V s, respectively, within an experimental error of 5%. In an annealing process, the redistribution and/or the segregation of NTD impurities is not observed. We also discuss the limitations of low-level NTD in semi-insulating GaAs. It is suggested that the activation of the NTD-impurities below {similar to}1{times}10{sup 16} cm{sup {minus}3} is mainly restricted by the presence of the midgap electron trap (EL2).

OSTI ID:
6925094
Journal Information:
Journal of Applied Physics; (USA), Journal Name: Journal of Applied Physics; (USA) Vol. 67:7; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English