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Reliability effects of x-ray lithography exposures on submicron-channel MOSFETs

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:6908002
;  [1]
  1. Army Research Lab., Adelphi, MD (United States)
Submicron-channel-length n and p-channel MOSFETs subjected to channel hot-carrier stressing were investigated, and the reliability of devices with and without exposure to simulated x-ray lithography processing steps was compared. No significant differences were observed between the sample groups.
OSTI ID:
6908002
Report Number(s):
CONF-930704--
Conference Information:
Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Journal Volume: 40:6Pt1
Country of Publication:
United States
Language:
English