Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Plasma etched polycrystalline hot-filament chemical vapor deposited diamond thin films and their electrical characteristics

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.112578· OSTI ID:6820272
; ; ; ; ; ;  [1]
  1. College of Engineering, University of Missouri, Columbia, Missouri 65211 (United States)
Etching of hot-filament, chemical vapor deposited, diamond thin films utilizing low energy ion irradiation was investigated. The films used in this study were boron doped polycrystalline diamond, deposited on [ital p]-type (100) oriented silicon substrates. A low voltage dc corona discharge with an oxygen plasma was used to sputter etch the films. Surfaces were investigated by scanning electron microscopy and profilometry. Etch rates were approximately 500 A/min, depending on the various processing conditions. Characteristics of In/diamond/Si Schottky diodes were used to evaluate the electrical properties of diamond surfaces with various treatments. Results indicate that plasma etching can significantly affect Schottky device characteristic.
DOE Contract Number:
FG02-91ER12107
OSTI ID:
6820272
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 65:22; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English