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Recrystallization of implanted amorphous silicon layers. I. Electrical properties of silicon implanted with BF/sup +//sub 2/ or Si/sup +/+B/sup +/

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.325688· OSTI ID:6782844

Electrical properties of recrystallized amorphous silicon layers, formed by BF/sup +//sub 2/ implants or Si/sup +/+B/sup +/ implants, have been studied by differential resistivity and Hall-effect measurements. Electrical carrier distribution profiles show that boron atoms inside the amorphized Si layers can be fully activated during recrystallization at 550 /sup 0/C. The mobility is also recovered. However, the tail of the B distribution, located inside a damaged region near the original amorphous-crystalline interface, remains inactive. This inactive tail has been observed for all samples implanted with BF/sup +//sub 2/. Only in a thicker amorphous layer, formed for example by Si/sup +/ predamage implants, can the entire B profile be activated. The etch rate of amorphous silicon in HF and the effect of fluorine on the recrystallization rate are also reported.

Research Organization:
Coordinated Science Laboratory and Department of Electrical Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
OSTI ID:
6782844
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Journal Issue: 1 Vol. 50:1; ISSN JAPIA
Country of Publication:
United States
Language:
English