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Interdiffusion and interfacial reaction between an YBa/sub 2/Cu/sub 3/O/sub x/ thin film and substrates

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.100460· OSTI ID:6782286

Interdiffusion and interfacial reaction between a sputter-deposited YBa/sub 2/Cu/sub 3/O/sub x/ thin film and substrates (MgO, sapphire, quartz, and Si) have been investigated by 2.7 MeV /sup 4/He/sup +/ Rutherford backscattering spectrometry. The diffusivities of Cu in the substrates and of the substrate elements (Mg, Al, and Si) in the Y-Ba-Cu-O thin films have been determined over the annealing temperature range from 876 to 1226 K in an oxygen atmosphere. Among three metallic elements of Y, Ba, and Cu, Cu diffuses the fastest into the substrates. Copper silicide is observed in the interfacial region between the film and the Si substrate. Among these substrates, MgO is suggested to be the most stable on annealing.

Research Organization:
Institute for Materials Research, Tohoku University, Sendai 980, Japan
OSTI ID:
6782286
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 53:15; ISSN APPLA
Country of Publication:
United States
Language:
English