Hermetic sealing of hybrid microcircuits. Final report

Technical Report · Mon Sep 01 04:00:00 EDT 1980

DOI:https://doi.org/10.2172/6775473· OSTI ID:6775473

Williams, J. H.

The capability to hermetically seal hybrid microcircuits and large-scale integrated circuits was established. Initial production results indicate a yield of 75% for hybrid flatpacks and 95% for integrated circuit packages. Future efforts will include particle impact noise detection testing of sealed packages and the development of a rework capability for hermetically sealed packages that must be opened, repaired, and resealed.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6775473
• Report Number(s): BDX-613-2486
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ELECTRONIC CIRCUITS
FABRICATION
INTEGRATED CIRCUITS
LEAKS
MATERIALS
MICROELECTRONIC CIRCUITS
PACKAGING
SEALING MATERIALS
SEALS