Microelectronics packaging automation
Technical Report
·
OSTI ID:6855704
Microelectronic packaging evaluations were completed that established process capabilities for wire bond testing data analysis, eutectic die attach, and hermetic sealing. These processes are used for chip and wire hybrid microcircuits (HMCs), leadless chip carriers (LCCs), and large-scale integrated circuits (LSIs) manufactured at the Kansas City Division.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Organization:
- DOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6855704
- Report Number(s):
- KCP-613-4968; ON: DE93004822
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ALLOYS
AUTOMATION
BONDING
DIES
DOCUMENT TYPES
ELECTRONIC CIRCUITS
FABRICATION
GOLD ALLOYS
INTEGRATED CIRCUITS
JOINING
MICROELECTRONIC CIRCUITS
PLATINUM ALLOYS
PLATINUM METAL ALLOYS
PROGRESS REPORT
SEALS
TIN ALLOYS
WIRES
360101 -- Metals & Alloys-- Preparation & Fabrication
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ALLOYS
AUTOMATION
BONDING
DIES
DOCUMENT TYPES
ELECTRONIC CIRCUITS
FABRICATION
GOLD ALLOYS
INTEGRATED CIRCUITS
JOINING
MICROELECTRONIC CIRCUITS
PLATINUM ALLOYS
PLATINUM METAL ALLOYS
PROGRESS REPORT
SEALS
TIN ALLOYS
WIRES