Bond test data acquisition and analysis system

Technical Report · Fri Feb 01 04:00:00 EST 1985

OSTI ID:6101174

Long, D D; Harte, J R

The Microelectronics Departments at Bendix Kansas City manufacture thick- and thin-film chip and wire hybrid circuits, Leadless Chip Carrier (LCC) subhybrids, surface mount thick-film hybrids, RF thin-film hybrids, and packaging of Large Scale Integrated Circuits (LSI's). All of these circuits are manufactured for high reliability applications which require extensive bond testing to verify product quality. This system has been designed and set up initially to acquire wire bond pull testing data (destructive and nondestructive) and component shear testing data, and to assist in performing analysis in a selective manner on the data base to generate a statistical graphics output.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6101174
• Report Number(s): BDX-613-3161R; ON: DE85007021
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
COMPUTER CODES
DATA ACQUISITION SYSTEMS
ELECTRIC CONTACTS
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
EQUIPMENT
INTEGRATED CIRCUITS
MICROELECTRONIC CIRCUITS