Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits
Thermosonic wire bonding is used to attach 1-mil gold wires to multilayer thick-film hybrid microcircuits manufactured by the Bendix Corporation, Kansas City Division for the Department of Energy. This study was conducted to develop a realistic, nondestructive pull test limit which would detect unacceptable wire bonds and would be compatible with production processes without applying excessive stress to the wires. The effect of environmental testing on wire bond strength was also examined. A 1.5-gf nondestructive pull test limit was incorporated into production which provided an adequate screen for unacceptable bonds without significantly increasing rework time and cost for wire failures. No degradation of wire bond strengths resulted from environmental testing.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6094916
- Report Number(s):
- BDX-613-2859R; ON: DE83014368
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420500 -- Engineering-- Materials Testing
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
BONDING
ELECTRIC CONTACTS
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FABRICATION
GOLD
JOINING
MATERIALS TESTING
METALS
MICROELECTRONIC CIRCUITS
NONDESTRUCTIVE TESTING
TESTING
TRANSITION ELEMENTS
WIRES