Wire interconnection reliability and moisture levels in hybrid microcircuits with epoxy-attached components
Conference
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OSTI ID:6083996
A hybrid microcircuit chip and wire technology was evaluated that consists of chip components attached by epoxy to either thin film or multilayer thick film networks and interconnected with gold wires. This technology was reviewed to qualify it for Department of Energy products, which must withstand long-term storage and extreme environmental requirements. The study included destructive wire pull testing, ball bond shear testing, internal moisture and material analysis, environmental testing, and accelerated aging. Wire pull strengths that averaged 8.92 g and ball bond shear strengths that averaged 44 g were similar, regardless of the HMC assembly, environmental, or aging conditions. Minimum wire pull strengths that met Mil-Std-883C requirements comprised 99.55% of the total wires, and average internal moisture levels met Mil-Std-883C requirements. Wire pull strengths did not decrease, and bond delaminations and intermetallics did not increase after accelerated aging for 1000 hours at 150/sup 0/C. An existing chip and wire technology will be upgraded by replacing the present component epoxy with one that generates lower moisture levels and contamination. Plasma cleaning components and networks before wire bonding also will improve wire reliability. Thermosonic wire bond schedules will be optimized for specific chip components, and intermetallic and epoxy contamination problems will be monitored with ball bond shear testing.
- Research Organization:
- Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6083996
- Report Number(s):
- BDX-613-3721; CONF-8709114-1; ON: DE87012987
- Country of Publication:
- United States
- Language:
- English
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