Hermetic sealing of hybrid microcircuits: initial capability development
The capability to hermetically seal hybrid microcircuits has been established. Tests indicate that helium fine leak rates in the low 10/sup -8/ STP cm/sup 3//s region and moisture content of less than 500 ppm are obtained with the 80% gold--20% tin solder sealing process being used. Initial production results indicate a yield of bettr than 90% for the process. Work is continuing to improve the capability to reseal packages that have been opened for rework. Future efforts will include evaluations of moisture sensors for use in hybrid packages, particle impact noise detection testing of sealed packages, and the use of laser welding as an alternate method for sealing packages.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 6546987
- Report Number(s):
- BDX-613-1930(Rev.)
- Country of Publication:
- United States
- Language:
- English
Similar Records
Hermetic sealing of hybrid microcircuits. Final report
Welding of hermetic connectors
Feasibility of electroplated gold for hybrid microcircuits. Final report
Technical Report
·
Mon Sep 01 00:00:00 EDT 1980
·
OSTI ID:6775473
Welding of hermetic connectors
Technical Report
·
Sun Aug 01 00:00:00 EDT 1976
·
OSTI ID:7338503
Feasibility of electroplated gold for hybrid microcircuits. Final report
Technical Report
·
Mon Oct 31 23:00:00 EST 1977
·
OSTI ID:5304230