Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors

Patent · Mon Jan 30 23:00:00 EST 1989

OSTI ID:6729105

Norwood, D P

A standard thin film circuit containing Ta/sub 2/N (100 ohms/square) resistors is fabricated by depositing on a dielectric substrate successive layers of Ta/sub 2/N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standard TFN (thin film network) manufacturing process enables the formation of Ta/sub 2/N + Ti (10 ohms/square) and Ta/sub 2/N + Ti + Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure. All three types of resistors are temperature-stable and laser-trimmable for precise definition of resistance values.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-76DP00789
• Assignee: Dept. of Energy
• Patent Number(s): 4,801,469
• Application Number: 06/894,145
• OSTI ID: 6729105
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
FABRICATION
FILMS
GOLD
METALS
MICROELECTRONIC CIRCUITS
NITRIDES
NITROGEN COMPOUNDS
PALLADIUM
PLATINUM METALS
PNICTIDES
REFRACTORY METAL COMPOUNDS
RESISTORS
TANTALUM COMPOUNDS
TANTALUM NITRIDES
THIN FILMS
TITANIUM
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS