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Title: Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors

Abstract

A standard thin film circuit containing Ta/sub 2/N (100 ohms/square) resistors is fabricated by depositing on a dielectric substrate successive layers of Ta/sub 2/N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standard TFN (thin film network) manufacturing process enables the formation of Ta/sub 2/N + Ti (10 ohms/square) and Ta/sub 2/N + Ti + Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure. All three types of resistors are temperature-stable and laser-trimmable for precise definition of resistance values.

Inventors:
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Org.:
USDOE
OSTI Identifier:
6729105
Patent Number(s):
4,801,469
Application Number:
06/894,145
Assignee:
Dept. of Energy
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MICROELECTRONIC CIRCUITS; FABRICATION; GOLD; PALLADIUM; RESISTORS; TANTALUM NITRIDES; THIN FILMS; TITANIUM; ELECTRICAL EQUIPMENT; ELECTRONIC CIRCUITS; ELEMENTS; EQUIPMENT; FILMS; METALS; NITRIDES; NITROGEN COMPOUNDS; PLATINUM METALS; PNICTIDES; REFRACTORY METAL COMPOUNDS; TANTALUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS; TRANSITION ELEMENTS; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Norwood, D P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States: N. p., 1989. Web.
Norwood, D P. Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors. United States.
Norwood, D P. Tue . "Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors". United States. https://www.osti.gov/servlets/purl/6729105.
@article{osti_6729105,
title = {Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors},
author = {Norwood, D P},
abstractNote = {A standard thin film circuit containing Ta/sub 2/N (100 ohms/square) resistors is fabricated by depositing on a dielectric substrate successive layers of Ta/sub 2/N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standard TFN (thin film network) manufacturing process enables the formation of Ta/sub 2/N + Ti (10 ohms/square) and Ta/sub 2/N + Ti + Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure. All three types of resistors are temperature-stable and laser-trimmable for precise definition of resistance values.},
doi = {},
url = {https://www.osti.gov/biblio/6729105}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1989},
month = {1}
}

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