Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Formation of subsurface Al/sub 2/O/sub 3/ layers in aluminum by oxygen ion implantation

Conference ·
OSTI ID:6685169
The use of high-dose oxygen ion implants to create buried, insulating SiO/sub 2/ layers in silicon has been reported by many groups. In contrast, only a few groups have studied ion-implanted oxide layers on and in aluminum films. We have investigated the formation of subsurface Al/sub 2/O/sub 3/ layers in bulk, polycrystalline aluminum. In particular, we implanted 1 to 16 x 10/sup 17/ atoms cm/sup -2/ using low current densities of 180 keV O/sub 2//sup +/ near room temperature. Depth distributions of oxygen and aluminum were determined using both Auger-electron spectroscopy combined with argon-ion sputtering and helium-ion backscattering. For oxygen fluences greater than about 8 x 10/sup 17/ atoms cm/sup -2/ our analyses revealed subsurface layers of Al/sub 2/O/sub 3/ were formed with thicknesses that increased with implanted dose. We combined our results with those from the aluminum literature to propose a formation process.
Research Organization:
Lawrence Livermore National Lab., CA (USA); California Univ., Davis (USA). Dept. of Applied Science; Connecticut Univ., Storrs (USA)
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
6685169
Report Number(s):
UCRL-90479; CONF-840760-8; ON: DE84015599
Country of Publication:
United States
Language:
English