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Formation of a nearly pure aluminum layer in beryllium using ion implantation

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.100977· OSTI ID:6623204
A nearly pure subsurface layer of an implanted element was created using aluminum implantation into beryllium. In particular, post-implant annealing of polycrystalline beryllium samples implanted with 200 keV aluminum caused a dramatic increase in the peak aluminum concentration as determined by Rutherford backscattering. The effect was observed for all three doses studied: 0.46, 1.1, and 4.6 x 10/sup 18/ Al/cm/sup 2/ . For the 1.1 x 10/sup 18/ Al/cm/sup 2/ case, cross-sectional transmission electron microscopy of the annealed sample revealed a distinct subsurface layer with the structure of crystalline aluminum. Auger sputter profiles of individual grains showed the layer purity to be as high as 98 at. % aluminum. However, there were indications that the layer formation and/or purity were grain dependent.
Research Organization:
University of California, Davis, California 95616
OSTI ID:
6623204
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 54:4; ISSN APPLA
Country of Publication:
United States
Language:
English