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Glancing angle EXAFS studies of Cu-Al thin film interfaces

Conference ·
OSTI ID:6669438
;
The glancing angle EXAFS technique has been employed to study the initial reactions on Cu-Al thin film interfaces. Samples prepared under uhv and non-uhv conditions are compared. Preliminary data indicate that the uhv prepared interface has a larger amount of initial reaction than the non-uhv one. When annealed at 160/degree/C, the resulting compound formation at the interfaces of the two samples are different. 4 refs., 1 fig., 1 tab.
Research Organization:
Brookhaven National Lab., Upton, NY (USA)
DOE Contract Number:
AC02-76CH00016; AS05-80ER10742
OSTI ID:
6669438
Report Number(s):
BNL-41815; CONF-8808149-5; ON: DE89003614
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
360602* -- Other Materials-- Structure & Phase Studies
ALUMINIUM
ANNEALING
BOND LENGTHS
COPPER
DIMENSIONS
ELEMENTS
FILMS
HEAT TREATMENTS
INCIDENCE ANGLE
INTERFACES
LENGTH
METALS
OPTICAL PROPERTIES
PHYSICAL PROPERTIES
REFLECTIVITY
SURFACE PROPERTIES
THIN FILMS
TRANSITION ELEMENTS