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Nonaqueous chemical etch for YBa/sub 2/Cu/sub 3/O/sub 7-//sub x/

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.100547· OSTI ID:6619475
A nonaqueous chemical etch, with Br as the active ingredient, is described which removes the insulating hydroxides and carbonates that form on high-temperature superconductor surfaces as a result of atmospheric exposure. X-ray photoemission spectra have been recorded before and after etching YBa/sub 2/Cu/sub 3/O/sub 7-//sub x/ films. It is found that, after the etch, the high binding energy O 1s and Ba 3d peaks associated with surface contaminants are greatly reduced, the Y:Ba:Cu ratio is close to the expected 1:2:3, and the oxidation state of the Cu(2+) is not affected. The resistance of an etched film reaches zero at 78 K, compared to 81 K for a similar unetched film. The suitability of other nonaqueous halogen-based etches is discussed, as is the applicability of this etch to other high T/sub c/ superconductors.
Research Organization:
Jet Propulsion Laboratory, California Institute of Technology, Pasadena, California 91109
OSTI ID:
6619475
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 53:26; ISSN APPLA
Country of Publication:
United States
Language:
English