Short and long loop manufacturing feedback using a multi-sensor assembly test chip
A three generation family of CMOS silicon test chips for packaging diagnostics has been developed. These Assembly Test Chips (ATC) contain sensors that measure a number of variables associated with assembled IC degradation, including the degree of IC corrosion, handling damage, ESD threat, ppm, moisture, mechanical stress, mobile ion density, bond pad cratering, and high speed logic degradation. The ATC family are intended to give manufacturing feedback in four ways: direct feedback in evaluation of an Assembly Manufacturing Line in an objective, non-intrusive way; before and after comparisons on an assembly production line when an individual process, material, or piece of equipment has been changed; resident lifetime monitor for system package aging and ongoing reliability projection and thermal, mechanical, dc electrical, and high frequency mock-up evaluation of packaging (including multichip) schemes. 14 refs., 6 figs., 2 tabs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- Sponsoring Organization:
- DOE/DP
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6611654
- Report Number(s):
- SAND-90-2033C; CONF-9010158--2; ON: DE90017595
- Country of Publication:
- United States
- Language:
- English
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Electron Devices & Circuits-- (1990-)
AGING
BONDING
CHEMICAL REACTIONS
CONTROL
CORROSION
DAMAGE
DESIGN
DIAGNOSTIC TECHNIQUES
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
FABRICATION
FAILURE MODE ANALYSIS
FEEDBACK
INTEGRATED CIRCUITS
JOINING
LAYERS
MEASURING METHODS
MICROELECTRONIC CIRCUITS
MOISTURE
MONITORING
OPTIMIZATION
PACKAGING
PHYSICAL PROPERTIES
PROCESS CONTROL
RELIABILITY
SENSITIVITY
SPECIFICATIONS
STRESS ANALYSIS
STRUCTURAL MODELS
SYSTEM FAILURE ANALYSIS
SYSTEMS ANALYSIS