Multichip module enablers for high reliability applications
Multichip modules (MCMs) intended for decades of highly reliable operation require more than the manufacturer`s assurance based on one product-specific qualification test. There are few MCM production and field track records on which to base such confidence. To gain uniform, rigorous MCM qualification for high reliability applications, Sandia has developed; a set of assembly test chips which are available for manufacturers and users to evaluate, characterize, and compare the particular MCM technology in terms of materials, chemical aging, geometries, stress state, thermal management, and assembly techniques; standard interconnect test structures as ``test coupons`` on the MCM substrate in order to determine the aging reliability through accelerated aging and lot quality through statistics; and exhaustive chip pretest methodology through prepackaging in a way compatible with today`s military integrated circuit (IC) packaging assembly lines. 3 refs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10123933
- Report Number(s):
- SAND--91-2738C; CONF-920387--1; ON: DE92007659
- Country of Publication:
- United States
- Language:
- English
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