Multichip module enablers for high reliability applications

Conference · Mon Dec 31 23:00:00 EST 1990

OSTI ID:5827581

Chu, D; Reber, C A; Draper, B L; Sweet, J N; Palmer, D W

Multichip modules (MCMs) intended for decades of highly reliable operation require more than the manufacturer's assurance based on one product-specific qualification test. There are few MCM production and field track records on which to base such confidence. To gain uniform, rigorous MCM qualification for high reliability applications, Sandia has developed; a set of assembly test chips which are available for manufacturers and users to evaluate, characterize, and compare the particular MCM technology in terms of materials, chemical aging, geometries, stress state, thermal management, and assembly techniques; standard interconnect test structures as test coupons'' on the MCM substrate in order to determine the aging reliability through accelerated aging and lot quality through statistics; and exhaustive chip pretest methodology through prepackaging in a way compatible with today's military integrated circuit (IC) packaging assembly lines. 3 refs.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: DOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5827581
• Report Number(s): SAND-91-2738C; CONF-920387--1; ON: DE92007659
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420500 -- Engineering-- Materials Testing
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
AGING
ALUMINIUM
CHALCOGENIDES
CHEMICAL REACTIONS
COPPER
CORROSION
ELECTRONIC CIRCUITS
ELEMENTS
INTEGRATED CIRCUITS
MATERIALS TESTING
METALS
MICROELECTRONIC CIRCUITS
OXIDES
OXYGEN COMPOUNDS
PACKAGING
PERFORMANCE TESTING
RELIABILITY
SEMIMETALS
SILICON
SILICON COMPOUNDS
SILICON OXIDES
STANDARDS
SUBSTRATES
TESTING
TRANSITION ELEMENTS