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Adhesion of polysilicon microbeams in controlled humidity ambients

Technical Report ·
DOI:https://doi.org/10.2172/658196· OSTI ID:658196

The authors characterize in-situ the adhesion of surface micromachined polysilicon beams subject to controlled humidity ambients. Beams were freed by supercritical CO{sub 2} drying. Consistent adhesion results were obtained using a post-treatment in an oxygen plasma which rendered the microbeams uniformly hydrophilic. Individual beam deformations were measured by optical interferometry after equilibration at a given relative humidity (RH). Validation of each adhesion measurement was accomplished by comparing the deformations with elasticity theory. The data indicates that adhesion increases exponentially with RH from 30% to 95%, with values from 1 mJ/m{sup 2} to 50 mJ/m{sup 2}. Using the Kelvin equation, the authors show that the data should be independent of RH if a smooth interface is considered. By modeling a rough interface consistent with atomic force microscopy (AFM) data, the exponential trend is satisfactorily explained.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE Assistant Secretary for Management and Administration, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
658196
Report Number(s):
SAND--98-1034C; CONF-980405--; ON: DE98005456; BR: YN0100000
Country of Publication:
United States
Language:
English

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