Studies on ion scattering and sputtering processes in ion beam sputter-deposition of high Tc superconducting films: The optimization of deposition parameters

Conference · Thu Jan 25 04:00:00 EST 1990 · AIP Conference Proceedings (American Institute of Physics); (USA)

DOI:https://doi.org/10.1063/1.39032· OSTI ID:6535682

Ameen, M S; Auciello, O; Kingon, A I ^[1]; Krauss, A R ^[2]; Ray, M A ^[3]

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1. N. C. State University, Department of Materials Science and Engineering, Raleigh, NC 27695-7907 (USA) Microelectronics Center of North Carolina, Research Triangle Park, NC (USA)
2. Argonne National Laboratory, Chemistry Division, Argonne, IL (USA)
3. Microelectronics Center of North Carolina, Research Triangle Park, NC (USA)

Ion beam sputter-deposition is one of the techniques used for synthesizing high T{sub c} superconducting films in laboratory experiments. However, the scaling-up of this method for technological applications, such as in microelectronics, will require a better understanding of basic phenomena occurring during the deposition process. First results are presented here from experimental and computer simulation studies on ion scattering and sputtering processes. It is demonstrated that scattering of neutralized ions from the targets can result in undesirable erosion of, and inert gas incorporation in, the growing films, depending on the ion/target atom mass ratio and ion beam angle of incidence/target/substrate geometry. The studies indicate that sputtering by Kr{sup +} or Xe{sup +} ions is preferable to the most commonly used Ar{sup +} ions, since the undesirable phenomena mentioned above are minimized for the first two ions. These results are used to determine optimum sputter deposition geometry and ions beam parameters for growing high T{sub c} films.

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL
• DOE Contract Number: W-31109-ENG-38; FG05-88ER45359
• OSTI ID: 6535682
• Report Number(s): CONF-891092--
• Conference Information: Journal Name: AIP Conference Proceedings (American Institute of Physics); (USA) Journal Volume: 199:1
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201* -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
BEAMS
CHEMICAL ANALYSIS
COMPUTERIZED SIMULATION
COPPER
DEPOSITION
ELEMENTS
ENERGY BEAM DEPOSITION
EROSION
FILMS
HIGH-TC SUPERCONDUCTORS
ION BEAMS
ION MICROPROBE ANALYSIS
ION SCATTERING ANALYSIS
METALS
MICROANALYSIS
NONDESTRUCTIVE ANALYSIS
SIMULATION
SPUTTERING
SUPERCONDUCTING FILMS
SUPERCONDUCTORS
SURFACE COATING
TRANSITION ELEMENTS
YTTRIUM