Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Effects of interface reactions on electrical characteristics of metal-GaAs contacts

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.98918· OSTI ID:6506697
Solid-state interface reactions between metal thin films and (100) GaAs substrates at elevated temperatures are studied by conventional and heavy-ion Rutherford backscattering spectrometry, x-ray diffraction, and transmission electron microscopy. Metals investigated in this study include Pt, Pd, Ni, Co, Rh, and W. Electrical properties of the metal/n-GaAs diodes undergoing annealing treatments at various temperatures were also measured with the current-voltage dependence. Optimum diodes with maximum barrier heights as well as minimum leakage currents are obtained for diodes annealed at temperatures at which a uniform thin layer of reacted phase is observable at the interface. The barrier heights of the optimum diodes show a linear dependence on the work functions of the various metals. The range of these barrier heights is limited by nonstoichiometry related defects as suggested by a recently proposed amphoteric native defect model.
Research Organization:
Center for Advanced Materials and Department of Instrument Science, Lawrence Berkeley Laboratory, University of California, Berkeley, California 94720
DOE Contract Number:
AC03-76SF00098
OSTI ID:
6506697
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 51:3; ISSN APPLA
Country of Publication:
United States
Language:
English