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Analysis of neutron damage in high-temperature silicon carbide JFETs

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:6450697
Neutron-induced displacement damage effects in n-channel, depletion-mode junction-field-effect transistors (JFETs) fabricated on 6H-silicon carbide are reported as a function of temperature from room temperature (RT) to 300 C. The data are analyzed in terms of a refined model that folds in recently reported information on the two-level ionization energy structure of the nitrogen donors. A value of 5 [+-] 1 cm[sup [minus]3] per n/cm[sup 2] is obtained for the deep-level defect introduction rate induced by the neutron irradiation. Due to partial ionization of the donor atoms at RT, the carrier removal rate is a function of temperature, varying from 3.5 cm[sup [minus]1] at RT to 4.75 cm[sup [minus]1] at 300 C. The relative neutron effect on carrier mobility varies with temperature approximately as T[sup [minus]7/2], dropping by an order of magnitude at 300 C compared with the RT effect. The results offer further support for the use of SiC devices in applications which combine high-temperature and severe radiation environments, where the use of Si and GaAs technologies is limited.
OSTI ID:
6450697
Report Number(s):
CONF-940726--
Conference Information:
Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Journal Volume: 41:6Pt1
Country of Publication:
United States
Language:
English