Apparatus and method for selective area deposition of thin films on electrically biased substrates

Patent · Tue Jun 08 04:00:00 EDT 1999

OSTI ID:6450191

Zuhr, R A; Haynes, T E; Golanski, A

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.

• Sponsoring Organization: DOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC05-84OR21400
• Assignee: Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
• Patent Number(s): A; US 5910220
• Application Number: PPN: US 8-286371
• OSTI ID: 6450191
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360601 -- Other Materials-- Preparation & Manufacture
BEAMS
DEPOSITION
DESIGN
ELECTRIC POTENTIAL
ENERGY BEAM DEPOSITION
FILMS
ION BEAMS
SUBSTRATES
SURFACE COATING
THIN FILMS