Apparatus and method for selective area deposition of thin films on electrically biased substrates
Patent
·
OSTI ID:6825221
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.
- DOE Contract Number:
- AC05-84OR21400
- Assignee:
- Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
- Patent Number(s):
- A; US 5354583
- Application Number:
- PPN: US 7-972778
- OSTI ID:
- 6825221
- Country of Publication:
- United States
- Language:
- English
Similar Records
Apparatus and method for selective area deposition of thin films on electrically biased substrates
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Related Subjects
36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360601 -- Other Materials-- Preparation & Manufacture
DEPOSITION
ELECTRIC POTENTIAL
ENERGY BEAM DEPOSITION
EQUIPMENT
FILMS
SUBSTRATES
SURFACE COATING
THIN FILMS
360101* -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360601 -- Other Materials-- Preparation & Manufacture
DEPOSITION
ELECTRIC POTENTIAL
ENERGY BEAM DEPOSITION
EQUIPMENT
FILMS
SUBSTRATES
SURFACE COATING
THIN FILMS