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Selective suppression of photochemical dry etching using elevated surface impurity concentrations: A new technique for self-aligned etching

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.346499· OSTI ID:6429596
; ; ;  [1];  [2]
  1. Sandia National Laboratories, Albuquerque, NM (USA)
  2. Department of Chemical and Nuclear Engineering, University of New Mexico, Albuquerque, NM (USA)

High concentrations of recombination-promoting impurities in the near-surface region of a semiconductor can produce virtually complete suppression of carrier-driven photochemical etching processes. In-diffusion of Zn to levels appropriate for ohmic contact formation on GaAs (mid-10{sup 20}/cm{sup 3}) has been employed to reduce etching to an undetectable level in {ital n}-GaAs with {ital n}=1.0{times}10{sup 17} and 1.3{times}10{sup 18}/cm{sup 3} and to produce a greater than ten-fold reduction in etching of semi-insulating GaAs. Raman spectroscopy of the altered near-surface region shows enhanced electronic scattering, which indicates the presence of a sufficient impurity concentration to suppress etching. Transmission electron microscopy shows the near-surface region to be crystalline without significant numbers of defects following Zn diffusion. Possible applications of this process include self-aligned etching of transistor and laser structures.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
6429596
Journal Information:
Journal of Applied Physics; (USA), Journal Name: Journal of Applied Physics; (USA) Vol. 68:5; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English