Fabrication of deep submicron patterns with high aspect ratio using magnetron reactive ion etching and sidewall process
Conference
·
· Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
OSTI ID:6350633
- Microelectronics R D Centre, Beijing (China)
At present, the fabrication of patterns with deep submicron and nanometer dimensions has attracted strong attention for the study of nanoscale devices. A method for fabrication of fine patterns by conventional technologies such as optical lithography, trilayer resist, magnetron reactive ion etching (MRIE), and plasma enhanced chemical vapor deposition (PECVD) is described. Using the sidewall process for fine pattern transfer and magnetron reactive ion etching, deep submicron and nanometer patterns with high aspect ratio have been prepared. 3 refs., 6 figs.
- OSTI ID:
- 6350633
- Report Number(s):
- CONF-920575--
- Conference Information:
- Journal Name: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States) Journal Volume: 10:6
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360601* -- Other Materials-- Preparation & Manufacture
360605 -- Materials-- Radiation Effects
ASPECT RATIO
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DATA
DEPOSITION
ELECTRON TUBES
ELECTRONIC EQUIPMENT
ENERGY BEAM DEPOSITION
EQUIPMENT
ETCHING
EXPERIMENTAL DATA
FABRICATION
INFORMATION
MAGNETRONS
MICROSTRUCTURE
MICROWAVE EQUIPMENT
MICROWAVE TUBES
NUMERICAL DATA
SUBSTRATES
SURFACE COATING
SURFACE FINISHING
360601* -- Other Materials-- Preparation & Manufacture
360605 -- Materials-- Radiation Effects
ASPECT RATIO
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DATA
DEPOSITION
ELECTRON TUBES
ELECTRONIC EQUIPMENT
ENERGY BEAM DEPOSITION
EQUIPMENT
ETCHING
EXPERIMENTAL DATA
FABRICATION
INFORMATION
MAGNETRONS
MICROSTRUCTURE
MICROWAVE EQUIPMENT
MICROWAVE TUBES
NUMERICAL DATA
SUBSTRATES
SURFACE COATING
SURFACE FINISHING