Comparison of 6H-SiC, 3C-SiC, and Si for power devices

Journal Article · Mon Mar 01 04:00:00 EST 1993 · IEEE Transactions on Electron Devices (Institute of Electrical and Electronics Engineers); (United States)

DOI:https://doi.org/10.1109/16.199372· OSTI ID:6338911

Bhatnagar, Mohit; Baliga, B J ^[1]

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1. North Carolina State Univ., Raleigh (United States)

This paper defines the drift region properties of 6H-and 3C-SiC-based Schottky rectifiers and power MOSFET's to achieve breakdown voltages ranging from 50 to 5,000 V. Using these values, the output characteristics of the devices have been calculated and these are compared with the characteristics of Si devices. It is found that due to very low drift region resistance, 5,000-V SiC Schottky rectifiers and power MOSFET's can deliver on-state current density of 100 A/cm[sup 2] at room temperature with a forward drop of only 3.85 and 2.95 V, respectively. These values are superior to even that for silicon P-i-N rectifiers and gate turn-off thyristors. Both these SiC devices are expected to have excellent switching characteristics and ruggedness due to the absence of minority-carrier injection. Additionally, a thermal analysis based upon a peak junction temperature limit, as determined by packaging considerations, is presented. Using this analysis, it is found that 5,000-V, 6H-, and 3C-SiC MOSFET's and Schottky rectifiers would be approximately 20 and 18 times smaller than corresponding Si devices. This thermal analysis for the SiC indicates that these devices would allow operation at higher temperatures and at higher breakdown voltages than conventional Si devices. Also, a significant reduction in the die size is expected. This reduction in the die size would offset the higher cost of the material. The results of the analysis presented in this paper provide a strong impetus to embarking upon the fabrication of SiC power devices.

• OSTI ID: 6338911
• Journal Information: IEEE Transactions on Electron Devices (Institute of Electrical and Electronics Engineers); (United States), Journal Name: IEEE Transactions on Electron Devices (Institute of Electrical and Electronics Engineers); (United States) Vol. 40:3; ISSN 0018-9383; ISSN IETDAI
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
CARBIDES
CARBON COMPOUNDS
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
COMPARATIVE EVALUATIONS
CURRENT DENSITY
DEPOSITION
ELECTRIC POTENTIAL
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
ELECTRONIC EQUIPMENT
ENGINES
EQUIPMENT
EVALUATION
FABRICATION
FIELD EFFECT TRANSISTORS
GAS TURBINE ENGINES
HEAT ENGINES
INTERNAL COMBUSTION ENGINES
MATERIALS
MOS TRANSISTORS
MOSFET
PERFORMANCE
PHYSICAL PROPERTIES
PHYSICAL RADIATION EFFECTS
PROPULSION SYSTEMS
RADIATION EFFECTS
RECTIFIERS
SEMICONDUCTOR DEVICES
SEMICONDUCTOR MATERIALS
SILICON CARBIDES
SILICON COMPOUNDS
SURFACE COATING
THYRISTORS
TRANSISTORS
USES