Tungsten and other advanced metals for VLSI/ULSI applications 5

Conference · Mon Jan 01 04:00:00 EST 1990

OSTI ID:6338422

Wong, S S ^[1]; Furukawa, S ^[2]

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1. Stanford Univ., Stanford, CA (US)
2. Tokyo Inst. of Technology, Tokyo (JP)

This book reports on applications of CVD metals, focusing on tungsten. The papers summarize results in the understanding of surface reactions; the modeling of reactor and deposition kinetics; the development of blanket and selective tungsten deposition processes; the characterization of tungsten films; and the rapid development in other CVD metals such as copper and aluminum.

• OSTI ID: 6338422
• Report Number(s): CONF-8909348--; ISBN: 1-55899-086-2
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360601* -- Other Materials-- Preparation & Manufacture
42 ENGINEERING
426000 -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ABSTRACTS
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DEPOSITION
DOCUMENT TYPES
ELECTRONIC CIRCUITS
ELEMENTS
FABRICATION
INTEGRATED CIRCUITS
LEADING ABSTRACT
MATERIALS
METALS
MICROELECTRONIC CIRCUITS
SEMICONDUCTOR MATERIALS
SURFACE COATING
TRANSITION ELEMENTS
TUNGSTEN