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In situ TEM studies of the growth of strained Si sub 1 minus x Ge sub x by solid phase epitaxy

Conference ·
OSTI ID:6334020
;  [1];  [2]; ;  [3];  [4]
  1. Brown Univ., Providence, RI (USA). Div. of Engineering
  2. Oak Ridge Associated Universities, Inc., TN (USA)
  3. Carnegie-Mellon Univ., Pittsburgh, PA (USA). Dept. of Electrical and Computer Engineering
  4. Bellcore, Red Bank, NJ (USA)
In this paper we report on the epitaxial growth of strained thin films Si{sub 1-x}Ge{sub x} on Si by solid phase epitaxy. For these solid phase epitaxy experiments, a 180-nm-thick strained-layer of Si{sub 1-x}Ge{sub x} with x{sub Ge} = 11.6 at. % was epitaxially grown on {l angle}001{r angle} Si using chemical vapor deposition. The near surface region of the substrate, including the entire Si{sub 1-x}Ge{sub x} film, was then amorphized to a depth of 380 nm using a two step process of 100 keV, followed by 200 keV, {sup 29}Si ion implantation. The epitaxial regrowth of the alloy was studied with in situ TEM heating techniques which enabled an evaluation of the activation energy for strained solid phase epitaxial regrowth. We report that the activation energy Si{sub 1-x}Ge{sub x} (x = 11.6 at. %) strained-layer regrowth is 3.2 eV while that for unstrained regrowth of pure Si is 2.68 eV and that regrowth in the alloy is slower than in pure Si over the temperature range 490 to 600{degree}C. 8 refs., 3 figs., 1 tab.
Research Organization:
Oak Ridge National Lab., TN (USA); Oak Ridge Associated Universities, Inc., TN (USA)
Sponsoring Organization:
DOD; DOE/ER; NSF
DOE Contract Number:
AC05-84OR21400; AC05-76OR00033
OSTI ID:
6334020
Report Number(s):
CONF-901105-88; ON: DE91007278; CNN: N00014-90-J-4051; DMR-9002994
Country of Publication:
United States
Language:
English