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Combined effects of hot-carrier stressing and ionizing radiation in SiO[sub 2], NO, and ONO MOSFET's

Journal Article · · IEEE Electron Device Letters (Institute of Electrical and Electronics Engineers); (United States)
DOI:https://doi.org/10.1109/55.215093· OSTI ID:6318148
;  [1]; ;  [2]
  1. Phillips Lab., Kirtland AFB, NM (United States)
  2. TRW Microelectronic Research Center, Redondo Beach, CA (United States)
N-channel MOSFET's with different gate dielectrics, such as silicon dioxide, silicon dioxide annealed in nitrous oxide (NO), and reoxidized nitrided oxide (ONO) were first hot-carrier (HC) stressed and then irradiated to a total dose of 1.5 Mrd. For equal substrate current stressing NO devices have the least degradation, whereas the threshold voltage (V[sub t]) shift due to irradiation is maximum for these devices. For all three types of gate dielectrics the V[sub t] shift due to irradiation of HC stressed devices was higher than that of the unstressed device. However, for ONO devices the V[sub t] shift due to irradiation of the hot-electron (HE) stressed (stressing with V[sub d] = V[sub g] = 6.5 V) device was less than that of the unstressed device.
OSTI ID:
6318148
Journal Information:
IEEE Electron Device Letters (Institute of Electrical and Electronics Engineers); (United States), Journal Name: IEEE Electron Device Letters (Institute of Electrical and Electronics Engineers); (United States) Vol. 14:1; ISSN 0741-3106; ISSN EDLEDZ
Country of Publication:
United States
Language:
English