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Kinetics of silicon nitride crystallization in N/sup +/-implanted silicon

Journal Article · · J. Mat. Res.; (United States)
OSTI ID:6293686
Implantation of nitrogen at 150 KeV and a dose of 1 x 10/sup 18//cm/sup 2/ into (110) silicon results in the formation of an amorphized layer at the mean ion range, and a deeper tail of nitrogen ions. Annealing studies show that the amorphized layer recrystallizes into a continuous polycrystalline Si/sub 3/N/sub 4/ layer after annealing for 1 h at 1200 /sup 0/C. In contrast, the deeper nitrogen fraction forms discrete precipitates (located 1 ..mu..m below the wafer surface) in less than 1 min at this temperature. The areal density of these precipitates is 5 x 10/sup 7//cm/sup 2/ compared with a nuclei density of 1.6 x 10/sup 5//cm/sup 2/ in the amorphized layer at comparable annealing times. These data suggest that the nucleation step limits the recrystallization rate of amorphous silicon nitride to form continuous buried nitride layers. The nitrogen located within the damaged crystalline silicon lattice precipitates very rapidly, yielding semicoherent crystallites of ..cap alpha..--Si/sub 3/N/sub 4/.
Research Organization:
Department of Chemical and Nuclear Engineering, University of New Mexico, Albuquerque, New Mexico 87131
OSTI ID:
6293686
Journal Information:
J. Mat. Res.; (United States), Journal Name: J. Mat. Res.; (United States) Vol. 4:2; ISSN JMREE
Country of Publication:
United States
Language:
English