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Titanium silicide formation on boron-implanted silicon

Journal Article · · J. Electrochem. Soc.; (United States)
DOI:https://doi.org/10.1149/1.2114253· OSTI ID:6216114

Thin film interaction between Ti and boron-implanted silicon substrates at 650/sup 0/-900/sup 0/ C was investigated. The compositional properties were examined with Rutherford backscattering spectrometry and secondary ion mass spectrometry, the structural properties with x-ray diffraction, and the electrical properties with sheet resistance measurements. At 650/sup 0/ C, incomplete Ti/Si reaction led to significant amounts of intermediate silicide phases (Ti/sub 5/Si/sub 3/ and TiSi) and hence higher sheet resistance. Annealing at 700/sup 0/ C or higher resulted in conversion of the titanium film into predominantly TiSi/sub 2/ and a lower sheet resistance. Boron was found to redistribute into the silicide layer during annealing, leading to an accumulation on the surface and a depletion at the silicide/silicon interface. The diffusion kinetics of boron through titanium silicide are compared with those of other p- and n-type dopants.

Research Organization:
General Electric Company, Corporate Research and Development, Schenectady, New York
OSTI ID:
6216114
Journal Information:
J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 132:8; ISSN JESOA
Country of Publication:
United States
Language:
English