Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Passivation of grain boundaries in polycrystalline silicon

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.90779· OSTI ID:6213786

Preferential diffusion of various gases down the grain boundaries in polycrystalline silicon is shown to promote significant changes in the density of defect states in these regions. A plasma of monatomic hydrogen provides a significant reduction in both the state density and the accompanying grain-boundary potential barrier while plasmas of oxygen, nitrogen, and sulfur hexafluoride are shown to increase this density of states. Boundaries passivated with hydrogen have as much as a factor of 1000 larger transconductance after treatment. Hydrogenated barriers are stable over long periods at 375 /sup 0/C and essentially indefinitely at 23 /sup 0/C. The results have important implications for the development of low-cost thin-film silicon photovoltaic devices.

Research Organization:
Sandia Laboratories, Albuquerque, New Mexico 87185
OSTI ID:
6213786
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 34:5; ISSN APPLA
Country of Publication:
United States
Language:
English