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Sidewall damage in n/sup +/-GaAs quantum wires from reactive ion etching

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.101368· OSTI ID:6181829
Electron cyclotron resonance and radio frequency reactive ion etching have been used to fabricate narrow n/sup +/-GaAs wires employing CCl/sub 2/F/sub 2//He as the etch gas. A comparison of the induced sidewall damage is made using room-temperature conductivity measurements of the etched structures and the effect of overetching is investigated. In addition, preliminary analysis of low-temperature transport reveals that the amplitude of universal conductance fluctuations is extremely sensitive to sidewall damage.
Research Organization:
IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598
OSTI ID:
6181829
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 54:21; ISSN APPLA
Country of Publication:
United States
Language:
English