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Electrical damage induced by ion beam etching of GaAs

Journal Article · · J. Vac. Sci. Technol., B; (United States)
DOI:https://doi.org/10.1116/1.584023· OSTI ID:5617563
We have examined the electrical damage induced in GaAs by ion milling and ion beam assisted etching, relevant to the fabrication of small conducting structures. The depth of the damage was measured by Schottky barrier measurements with in situ deposited gold contacts and by resistance and mobility measurements of etched two-dimensional electron gas structures. The effect of exposed etched sidewalls on the conductivity of narrow wires was examined for GaAs/AlGaAs structures. We find that it is possible to create wires narrower than surface depletion lengths by defining the structures through ion beam induced damage without exposing the sidewalls. In particular, narrow conducting wires can be defined solely by etching the thin-undoped-GaAs cap layer atop the modulation doped material.
Research Organization:
Bell Communications Research, Red Bank, New Jersey 07701
OSTI ID:
5617563
Journal Information:
J. Vac. Sci. Technol., B; (United States), Journal Name: J. Vac. Sci. Technol., B; (United States) Vol. 6:1; ISSN JVTBD
Country of Publication:
United States
Language:
English