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Photoemission investigation of the electronic structure at polycrystalline CuInSe[sub 2] thin-film interfaces

Journal Article · · Journal of Applied Physics; (United States)
DOI:https://doi.org/10.1063/1.354195· OSTI ID:6145447
; ; ;  [1]; ;  [2]
  1. National Renewable Energy Laboratory, Golden, Colorado 80401 (United States)
  2. Synchrotron Radiation Center, University of Wisconsin-Madison, Stoughton, Wisconsin 53589 (United States)

The surface versus bulk composition and electronic structure of polycrystalline CuInSe[sub 2] thin-film interfaces were studied by synchrotron radiation soft-x-ray photoemission spectroscopy. An [ital n]-type In[sub 2]Se[sub 3]/CuIn[sub 3]Se[sub 5] surface layer forms on enhanced-grain polycrystalline thin-film [ital p]-type CuInSe[sub 2] during fabrication. Enhanced-grain CuInSe[sub 2] films were sputter etched (500 V Ar) and analyzed [ital in] [ital situ] to determine core-level binding energies and Fermi-level positions for the [ital n]-type surface and the [ital p]-type CuInSe[sub 2] bulk within [plus minus]0.1 eV. The transition between the [ital n]-type surface and the [ital p]-type bulk was experimentally observed by noting the change in the position of the valence-band maximum relative to the Fermi level [ital E][sub [ital F]]. From these measurements, the valence-band offset [Delta][ital E][sub [ital v]] between the layers was determined to be 0.50 eV. Measurement of the work functions [phi] was also completed and reveals [phi]=4.75 eV for the In[sub 2]Se[sub 3] (CuIn[sub 3]Se[sub 5]) surface layer and [phi]=4.04 eV for the bulk CuInSe[sub 2]. Combining these results allows construction of a surface band diagram for this device configuration as well as determination of the relationship between composition, electronic structure, and device performance.

DOE Contract Number:
AC02-83CH10093
OSTI ID:
6145447
Journal Information:
Journal of Applied Physics; (United States), Journal Name: Journal of Applied Physics; (United States) Vol. 74:9; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English