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Near-surface microstructural modifications in low energy hydrogen ion bombarded silicon

Journal Article · · J. Vac. Sci. Technol., A; (United States)
DOI:https://doi.org/10.1116/1.573201· OSTI ID:6108006
We have bombarded single crystal (100) and (111) silicon with a hydrogen ion beam produced by a Kaufman ion source. A range of dose rates from 0.2--2.0 mA/cm/sup 2/, bulk sample temperatures from 35/sup 0/--350/sup 0/ C, and doses of 2 x 10/sup 17/, 2 x 10/sup 18/, and 2 x 10/sup 19/ ions/cm/sup 2/ at maximum ion energies of 1600 eV was explored. Transmission electron microscopy and electron spin resonance measurements were used to characterize the bombarded samples. Extensive microstructural modifications occur as a result of hydrogen ion bombardment; the orientation, size, density, and distribution of the features which form vary as a function of crystal orientation, dose rate, bulk temperature, and total dose. Electron spin resonance studies indicate no detectable change in the number of occupied unpaired electron spin states occur in conjunction with this damage.
Research Organization:
Sandia National Laboratories, Albuquerque, New Mexico 87185
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6108006
Journal Information:
J. Vac. Sci. Technol., A; (United States), Journal Name: J. Vac. Sci. Technol., A; (United States) Vol. 3:1; ISSN JVTAD
Country of Publication:
United States
Language:
English