Processing techniques for refractory integrated circuits
Conference
·
· IEEE Trans. Magn.; (United States)
OSTI ID:6086811
Processing techniques have been developed to increase yields and uniformity in superconductor integrated circuits labricated with refractory materials. An eight level process was used to define a ground plane, ground plane insulator, Josephson junction base and counter electrodes, a second insulator layer, superconductor interconnections, resistors, and gold contact pads. Every layer, except the gold, was patterned by reactive ion etching. A new resistor structure was developed that included an etch stop layer. The formation of polymers, which occurs with etch gases containing carbon, was inhibited by the addition of oxygen to the plasma. Reactive ion etching of insulator vias was accomplished with a mixture of NF/sub 3/ and Ar that gave good selectivity for silicon dioxide over niobium. Stress-free films of niobium, molybdenum, and silicon dioxide were obtained by adjusting the sputtering gas pressure. Molybdenum resistors, deposited as a top layer, were trimmed by RIE as a post-testing step to improve circuit performance.
- Research Organization:
- Westinghouse R and D Center, Pittsburgh, PA (US); Intermagnetics General Corp., Guilderland, NY (US)
- OSTI ID:
- 6086811
- Report Number(s):
- CONF-880812-
- Conference Information:
- Journal Name: IEEE Trans. Magn.; (United States) Journal Volume: 25:2
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
420201* -- Engineering-- Cryogenic Equipment & Devices
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
656003 -- Condensed Matter Physics-- Interactions between Beams & Condensed Matter-- (1987-)
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALLOYS
CHALCOGENIDES
ELECTRONIC CIRCUITS
ELEMENTS
ETCHING
FABRICATION
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
MATERIALS
MATRIX MATERIALS
METALS
MICROELECTRONIC CIRCUITS
NIOBIUM
OXIDES
OXYGEN COMPOUNDS
PERFORMANCE
PLASMA
POLYMERS
PROCESSING
REFRACTORY METALS
SILICON COMPOUNDS
SILICON OXIDES
SOLID-STATE PLASMA
SPUTTERING
SUPERCONDUCTING JUNCTIONS
SUPERCONDUCTORS
SURFACE FINISHING
TECHNOLOGY ASSESSMENT
TRANSITION ELEMENTS
420201* -- Engineering-- Cryogenic Equipment & Devices
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
656003 -- Condensed Matter Physics-- Interactions between Beams & Condensed Matter-- (1987-)
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ALLOYS
CHALCOGENIDES
ELECTRONIC CIRCUITS
ELEMENTS
ETCHING
FABRICATION
INTEGRATED CIRCUITS
JOSEPHSON JUNCTIONS
JUNCTIONS
MATERIALS
MATRIX MATERIALS
METALS
MICROELECTRONIC CIRCUITS
NIOBIUM
OXIDES
OXYGEN COMPOUNDS
PERFORMANCE
PLASMA
POLYMERS
PROCESSING
REFRACTORY METALS
SILICON COMPOUNDS
SILICON OXIDES
SOLID-STATE PLASMA
SPUTTERING
SUPERCONDUCTING JUNCTIONS
SUPERCONDUCTORS
SURFACE FINISHING
TECHNOLOGY ASSESSMENT
TRANSITION ELEMENTS