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Title: Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation

Conference ·
OSTI ID:6025541

Ion irradiation and annealing experiments have been conducted on Au/Cu bilayer films to evaluate the effect of irradiation on diffusion-induced grain boundary migration (DIGM). The Au films were prepared with a large-grained microstructure with grain boundaries perpendicular to the film surface and extending through the film thickness. Irradiations were conducted with 1.5 MeV Kr at 228{degree}C. Rutherford backscattering spectrometry of the samples revealed that interdiffusion was substantially enhanced in the irradiated area relative to the unirradiated area. Both irradiated and annealed-only areas were characterized by a nearly uniform composition of 14 at.% and 7 at.% Cu respectively through the entire thickness of the underlying Au film. Small probe X-ray energy dispersive spectroscopy showed significant lateral compositional homogeneities in both irradiated and annealed areas. These two results are consistent with previous observations of DIGM in the Au/Cu system, suggesting that this previously unexamined mechanism contributes to ion beam mixing.

Research Organization:
Argonne National Lab., IL (United States)
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
W-31109-ENG-38
OSTI ID:
6025541
Report Number(s):
ANL/CP-73625; CONF-911202-19; ON: DE92005238
Resource Relation:
Conference: Annual fall meeting of the Materials Research Society, Boston, MA (United States), 2-6 Dec 1991
Country of Publication:
United States
Language:
English