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Title: Epoxy Foam Encapsulants: Processing and Dielectric Characterization

Abstract

The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.

Authors:
;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
5988
Report Number(s):
SAND99-8213
TRN: AH200115%%355
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: 1 Jan 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; DIELECTRIC MATERIALS; ENCAPSULATION; PERFORMANCE; POLYURETHANES; RESINS; URETHANE

Citation Formats

Domeier, Linda, and Hunter, Marion. Epoxy Foam Encapsulants: Processing and Dielectric Characterization. United States: N. p., 1999. Web. doi:10.2172/5988.
Domeier, Linda, & Hunter, Marion. Epoxy Foam Encapsulants: Processing and Dielectric Characterization. United States. https://doi.org/10.2172/5988
Domeier, Linda, and Hunter, Marion. 1999. "Epoxy Foam Encapsulants: Processing and Dielectric Characterization". United States. https://doi.org/10.2172/5988. https://www.osti.gov/servlets/purl/5988.
@article{osti_5988,
title = {Epoxy Foam Encapsulants: Processing and Dielectric Characterization},
author = {Domeier, Linda and Hunter, Marion},
abstractNote = {The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.},
doi = {10.2172/5988},
url = {https://www.osti.gov/biblio/5988}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}