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Title: Epoxy Foam Encapsulants: Processing and Dielectric Characterization

Technical Report ·
DOI:· OSTI ID:5988

The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Organization:
US Department of Energy (US)
Report Number(s):
SAND99-8213; TRN: AH200115%%355
Resource Relation:
Other Information: PBD: 1 Jan 1999
Country of Publication:
United States