Low density epoxy encapsulants
The resin, catalyst, and filler of an epoxy-hollow glass microsphere encapsulant were evaluated to solve problems associated with encapsulated electronic assemblies and an alternate source of hollow glass microspheres was selected. Specific problems related to the use of this encapsulant are discussed. The results of attempts to modify the blowing agent of an epoxy foam are also included.
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- DOE Contract Number:
- E(29-1)-613
- OSTI ID:
- 7356916
- Report Number(s):
- BDX-613-1411(Rev.)
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
AIR
CATALYSTS
COLLOIDS
DENSITY
DIELECTRIC MATERIALS
DISPERSIONS
ELECTRONIC EQUIPMENT
EPOXIDES
FABRICATION
FLUIDS
FOAMS
GASES
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
PHYSICAL PROPERTIES
SHRINKAGE
USES
VISCOSITY
VOIDS
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
AIR
CATALYSTS
COLLOIDS
DENSITY
DIELECTRIC MATERIALS
DISPERSIONS
ELECTRONIC EQUIPMENT
EPOXIDES
FABRICATION
FLUIDS
FOAMS
GASES
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
PHYSICAL PROPERTIES
SHRINKAGE
USES
VISCOSITY
VOIDS