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Characteristics of B-doped Si[sub 1[minus]x]Ge[sub x] growth rates by chemical vapor deposition using Si[sub 2]H[sub 6], GeH[sub 4], and B[sub 2]H[sub 6] gases

Journal Article · · Journal of the Electrochemical Society; (United States)
DOI:https://doi.org/10.1149/1.2220768· OSTI ID:5986343

Low temperature heteroepitaxy of highly B-doped Si[sub 1[minus]x]Ge[sub x] on Si by low pressure CVD has been investigated from the viewpoint of growth rate. The growth temperature was 550-730 C, and the concentration of B was 10[sup 18]-10[sup 21] cm[sup [minus]3]. For the undoped and B-doped Si[sub 0.75]Ge[sub 0.25], the growth rate was limited by the supply of Si[sub 2]H[sub 6] and GeH[sub 4] to the surface at temperatures above 630 C and by the desorption of hydrogen from the surface at temperatures below 630 C. The activation energy of the growth rate was 2.0 eV for undoped alloy below 630 C. A reduced activation energy was found for in situ B-doping. The growth rates of alloy (the surface reaction rates of Si[sub 2]H[sub 6] and GeH[sub 4]) increase with increase in the surface density of B deposited by the decomposition of B[sub 2]H[sub 6] on the surface. The deposition rate of B is determined only by the quantity of B[sub 2]H[sub 6] supplied to the surface and does not depend on the composition of the alloy surface layer or the growth temperature.

OSTI ID:
5986343
Journal Information:
Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Journal Issue: 7 Vol. 140:7; ISSN JESOAN; ISSN 0013-4651
Country of Publication:
United States
Language:
English