Patterned adhesion of electrolessly deposited copper on poly(tetrafluoroethylene). [electron or X-ray irradiation]

Journal Article · Tue Jun 01 04:00:00 EDT 1993 · Journal of the Electrochemical Society; (United States)

DOI:https://doi.org/10.1149/1.2221638· OSTI ID:5985327

Rye, R R; Ricco, A J ^[1]

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1. Sandia National Labs., Albuquerque, NM (United States)

Electroless deposition of Cu on Na naphthalenide-etched poly(tetrafluoroethylene) (PTFE) leads to adherent Cu film growth through a three-step solution process involving (1) sensitization by adsorption of Sn[sup II], (2) reduction of Pd[sup II] by adsorbed Sn[sup II] to produce Pd[sup 0] nucleation sites, and (3) reduction of Cu[sup II] by formaldehyde for Cu film growth. Cu film thickness is determined by exposure time in the Cu[sup II] solution. Adhesion is determined partly by the initial Sn[sup II] sensitization step: Sn from an aqueous solution is adsorbed onto and absorbed into the rough, porous, etched surface to produce a mechanically interlocked Sn-base for the subsequent steps. Patterned deposition of adherent Cu is achieved via area-selective irradiation of the surface to produce cross-linking and, subsequently, area selective etching. This results in major differences in adhesion strength of the resultant Cu film between the irradiated and nonirradiated areas: the Cu film on nonirradiated areas is not affected by a Scotch-tape peel test while on irradiated areas XPS spectra show that the Cu film, the Sn sensitizer layer, the Pd nucleation sites, and a major fraction of the etched layer are all easily and cleanly removed. After selective peeling of the Cu film and the active layer, continuation of Cu deposition in the Cu[sup II]/HCHO solution results in Cu deposition only on the remaining Cu film. Because the Sn/Pd sensitization/nucleation steps are general, the present results apply to all metals that can be electrolessly deposited.

• DOE Contract Number: AC04-76DP00789
• OSTI ID: 5985327
• Journal Information: Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Vol. 140:6; ISSN JESOAN; ISSN 0013-4651
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360603* -- Materials-- Properties
360605 -- Materials-- Radiation Effects
ADHESION
ADSORPTION
ALDEHYDES
CHEMICAL REACTIONS
COMPOSITE MATERIALS
COPPER
CROSS-LINKING
DEPOSITION
ELECTRON SPECTROSCOPY
ELEMENTS
ETCHING
FLUORINATED ALIPHATIC HYDROCARBONS
FORMALDEHYDE
HALOGENATED ALIPHATIC HYDROCARBONS
INTERFACES
IRRADIATION
MATERIALS
MECHANICAL PROPERTIES
METALS
ORGANIC COMPOUNDS
ORGANIC FLUORINE COMPOUNDS
ORGANIC HALOGEN COMPOUNDS
PALLADIUM
PETROCHEMICALS
PETROLEUM PRODUCTS
PHOTOELECTRON SPECTROSCOPY
PLASTICS
PLATINUM METALS
POLY
POLYETHYLENES
POLYMERIZATION
POLYTETRAFLUOROETHYLENE
RADIATION EFFECTS
REDUCTION
SORPTION
SPECTROSCOPY
SURFACE FINISHING
SURFACE PROPERTIES
SYNTHETIC MATERIALS
TEFLON
TIN
TRANSITION ELEMENTS
X-RAY SPECTROSCOPY