Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Transient liquid phase metallic bonding of an Inconel 718SPF superalloy

Journal Article · · Welding Journal
OSTI ID:596818
 [1];  [2]
  1. Chung-Hua Polytechnic Inst., Hsin-Chu (Taiwan, Province of China). Dept. of Mechanical Engineering
  2. National Taiwan Univ., Taipei (Taiwan, Province of China). Inst. of Materials Science and Engineering

The applicability of the transient liquid phase (TLP) metallic bonding method for joining fine-grained Inconel 718SPF{reg_sign} superalloy sheets by inserting a Ni-P or a Ni-Cr-P amorphous interlayer has been evaluated. The results show that a joint with uniform chemical composition could be obtained for the Inconel 718SPF superalloy with a Ni-P interlayer at 1,100 C for 8 h. When a Ni-Cr-P interlayer was used under the same metallic bonding conditions, the concentrations of nickel, iron and niobium in the bond region and in the base metal had a difference of more than 2 wt-%. This means that longer bonding time was required to homogenize the chemical compositions of bonds with a Ni-Cr-P interlayer. The joints with a Ni-P interlayer showed higher bond strength than did those with a Ni-Cr-P interlayer. Furthermore, many grain boundary precipitates were found.

OSTI ID:
596818
Journal Information:
Welding Journal, Journal Name: Welding Journal Journal Issue: 12 Vol. 76; ISSN 0043-2296; ISSN WEJUA3
Country of Publication:
United States
Language:
English

Similar Records

Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating
Journal Article · Mon Jan 31 23:00:00 EST 2000 · Journal of Materials Engineering and Performance · OSTI ID:20023160

Isostatic diffusion bonding of IN-718SPF sheet
Book · Mon Dec 30 23:00:00 EST 1996 · OSTI ID:442834

Effect of Joining Atmosphere in Transient Liquid Phase Bonding of Inconel 617 Superalloy
Journal Article · Thu Dec 14 23:00:00 EST 2017 · Metallurgical and Materials Transactions B, Process Metallurgy and Materials Processing Science · OSTI ID:22856067