Effect of Joining Atmosphere in Transient Liquid Phase Bonding of Inconel 617 Superalloy
- Amirkabir University of Technology (AUT), Department of Mining and Metallurgical Engineering (Iran, Islamic Republic of)
In the present paper, transient liquid phase (TLP) bonding of Inconel 617 alloy under the different furnace atmospheres of vacuum, argon gas, and air was investigated. The experiments were carried out at 1408 K (1135 °C) for 300 minutes by using BNi-1 filler metals with different thicknesses of 50 and 100 µm. The microstructure, chemical analysis, shear strength, and microhardness of the resultant joints were studied. After 300 minutes, complete isothermal solidification was obtained for both the interlayers having 50 and 100 µm thicknesses under all the furnace atmospheres. The specimens bonded under vacuum condition showed the highest shear strength, failure energy, and ductility. Also, the joint produced under argon gas atmosphere using 100-µm-thick filler metal showed a good strength and may be acceptable in many applications. However, the specimens bonded under air atmosphere were weak, due to their further cavities and non-dissolved carbides. The presence of non-dissolved carbides in the diffusion-affected zone resulted in increasing the hardness of the base metal near the interface. The carbides were dissolved and the hardness of the diffusion-affected zone was reduced under vacuum condition compared to argon and air atmospheres. The best result was obtained for the specimen joined using the 50-µm-thick interlayer under vacuum atmosphere, with about 95.8 pct joint efficiency.
- OSTI ID:
- 22856067
- Journal Information:
- Metallurgical and Materials Transactions B, Process Metallurgy and Materials Processing Science, Vol. 48, Issue 6; Other Information: Copyright (c) 2017 The Minerals, Metals & Materials Society and ASM International; http://www.springer-ny.com; Country of input: International Atomic Energy Agency (IAEA); ISSN 1073-5615
- Country of Publication:
- United States
- Language:
- English
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