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Isostatic diffusion bonding of IN-718SPF sheet

Book ·
OSTI ID:442834
 [1];  [2]
  1. Michigan Technological Univ., Houghton, MI (United States)
  2. Brush Wellman Inc., Elmore, OH (United States)

Isostatic diffusion bonding represents a potentially attractive technique for joining superplastically-formable nickel-base alloys such as Inconel alloy 718SPF sheet. Isostatic diffusion bonding trials have been carried out on Inconel alloy 718SPF/Inconel alloy 718SPF couples at temperatures ranging from 950 C (1,750 F) to 1,150 C (2,100 F) and isostatic pressures ranging up to 415 MPa (60,000 psi). Materials bonded at 1,150 C and 414 MPa exhibited room temperature shear strengths nearly comparable to those of the parent metal, but also showed substantial grain growth in the base metal away from the bond plane. Materials bonded at lower temperatures exhibited similar strengths with substantially less grain coarsening. Metallographic and mechanical testing results obtained on these diffusion bonded Inconel alloy 718SPF materials are presented and compared with existing diffusion bonding models.

OSTI ID:
442834
Report Number(s):
CONF-960515--; ISBN 0-87170-568-0
Country of Publication:
United States
Language:
English

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