Solderability improvements for drag soldered PWBs. Final report
Technical Report
·
OSTI ID:5955387
The causes of solderability problems on drag soldered printed wiring boards (PWBs) were investigated. Excessive removal of tin-lead from the PWB surface was found to be the major cause. A solder leveling method was incorporated to control the consistency of the tin-lead removal process.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5955387
- Report Number(s):
- BDX-613-2640; ON: DE82000961
- Country of Publication:
- United States
- Language:
- English
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